New !
SE73R12818 NanoSilver Die Attach for Ni plated substrates
(technical details coming soon !!!)
SCR12818 NanoSilver Die Attach Paste
Characteristics
- SCR12818 NanoSilver Paste is specifically designed and formulated for lowtemperature, low pressure sintering.
- The product is suitable for dispensing and stencil printing.
- It works very well on Cu, Ag and Au surfaces and Ti-Ni-Ag and Au die backside metallization.
Benefits
- Low sintering temperature (≈ 250ºC)
- Low sintering pressure (≈ 1MPa)
- Dispensable through standard equipment
- Printable with stencils down to 25 mm
- Good sintered mechanical, electrical and thermal characteristics
- RoHS compliant
Applications
SCR12818 NanoSilver Paste is intended for attaching Ag or Au back finished die onto bare Cu or Ag or Au finished DCB or leadframe substrates.
